VIA EPIA-T700- World’s First Mobile-ITX Module
VIA EPIA-T700 is the first product based on the recently announced Mobile-ITX form factor. The VIA EPIA-T700 can be used with a variety of carrier boards that can be adapted and customized to meet the needs of a range of applications and is powered by a specially miniaturized 1GHz VIA Eden ULV processor and the compact VIA VX820 MSP that together offer industry-leading I/O flexibility in the most compact of available form factors. The VIA EPIA-T700 features 512MB of DDR2 on-board system memory, meaning compatibility and reliability are guaranteed. The VIA EPIA-T700 uses two unique high density, low profile connectors on the under side of the module that can also withstand vibrations of up to 5Gs making Mobile-ITX systems suitable for in-vehicle and industrial machining applications.
The VIA VX820 media system processor adds a wealth of key features including the VIA Chrome9 DX9 integrated graphics core, the VIA Chromotion video engine with hardware acceleration of MPEG-2, MPEG-4, WMV9, and VC1 video formats, and VIA Vinyl HD Audio supporting up to eight channels of HD audio. Measuring a mere 6cm x 6cm, the VIA EPIA-T700 is a uniquely compact computer-on-module that is designed for a range of ultra-compact embedded devices in medical, military and in-vehicle applications.
