NTT DoCoMo, Renesas, Fujitsu and Sharp plan to jointly develop the SH-Mobile G4 single-chip LSI device, and a platform incorporating it, to support the HSUPA1/HSDPA2/W-CDMA and GSM/GPRS/EDGE (2G) mobile telephony standards. Development of the platform is targeted for completion by the forth quarter of fiscal 2009 (January–March 2010). The new SH-Mobile G4 will be fabricated with 45-nm process technology to enable highly integrated functions and extra-fast processing. It will provide enhanced functionality and improved performance for applications handling HD3 video and 3-D graphics.

In addition to HSDPA cat.8 for extra-fast downlink speeds (max. 7.2 Mbps), the SH-Mobile G4 will support HSUPA to boost uplink speeds to a maximum of 5.7 Mbps, almost 15 times faster than the conventional 384kbps speeds, thereby enabling much faster bidirectional data transfers. Renesas plans to provide the platform to the worldwide mobile phone market, in addition to customers in Japan.