TPO Displays Corp, Taiwan today introduced the world’s thinnest 2.0-inch QVGA day light readable module utilizing LTPS technology. Deploying ultra-thin capacitors to achieve a leading 0.95mm thickness, TPO is able to deliver superior performance where the design footprint is a major consideration. In reducing glass thickness, TPO has leveraged a cutting-edge chemical etching process, which allows both bipanes to be thinned to 0.2mm. TPO additionally applies ultra-thin capacitors on the display module to lower the overall thickness of the display module.

Placing the capacitors under the contact ledge reduces dead area on the glass. Engineering samples of TPO’s 2.0-inch QVGA module are currently available, with full Chip-on-Glass (COG) and Chip-On-Flex / Foil (COF) modules in 0.2mm glass sizes available in early August. 0.1 mm glass is currently under development and expected to be in mass production in 2008.